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SMT Placement Machine Malfunction? A 6-Step System Guide to Quickly Troubleshoot.
On a high-speed SMT production line, when a placement machine suddenly triggers an alarm or produces defective boards, it is undoubtedly the most nerve-wracking moment for every engineer and production line manager. Unplanned downtime incurs direct economic losses every minute, while chaotic emergency responses often exacerbate problems or lead to recurring failures.
Establishing a systematic, replicable fault diagnosis and resolution process is key to shifting from reactive response to proactive control. This article outlines a comprehensive strategy for addressing issues from symptom to root cause, helping you quickly pinpoint problems, resume production, and fundamentally reduce the occurrence of anomalies.
Step 1: Immediate Safe Halt and Phenomenon Verification
Step 1: Safety Pause and Quick Check (within 3 minutes)
Immediately execute upon detecting abnormalities:
1. Safety Pause: Press the equipment's emergency stop button
2. Record key information: Error code displayed on the equipment; Problem manifestation: Increased material ejection? Recognition error? Placement offset? Occurrence location (Which placement head? Which nozzle? Which feeder?)
3. Quick Check: Verify feeder installation and check for tape jams; inspect nozzles for blockages or damage; confirm normal equipment air pressure
Avoid restarting or debugging blindly before clearly identifying the phenomenon, as this may obscure the true root cause.
Step 2: Targeted Problem Diagnosis
| Quick Reference Guide for Frequently Asked Questions | ||
| Symptom | Priority Check Items | Possible Causes |
Increased Material Waste | 1. Nozzle Condition 2. Vacuum Pressure 3. Component Parameter Settings | Nozzle Blockage, Insufficient Vacuum, Incorrect Component Recognition Parameters |
Recognition Errors | 1. Camera Lens 2. Light Source Brightness 3. Component Library Settings | Lens contamination, poor lighting, mismatched recognition parameters |
Placement Deviation | 1. PCB Reference Mark 2. Placement Head Accuracy 3. Track Width | Mark contamination, uncalibrated equipment, unstable PCB positioning |
Equipment Alarm Shutdown | 1. Various Sensors 2. Driver Status 3. Software Prompts | Sensor Failure, Driver Alarm, Program Error |
Step 3: Standard Handling and Prevention
Standard Handling Process
Cleaning Maintenance: Clean nozzles, camera lenses, and mark points
Calibration Adjustment: Perform placement head precision calibration and feeder station calibration
Part Replacement: Replace worn nozzles and faulty feeder components
Parameter Optimization: Adjust component recognition parameters and placement parameters
Verification and Recovery
First conduct no-load tests to verify mechanical actions;
Perform small-batch trial production using test boards to validate issue resolution;
Closely monitor the quality of the first 50 pieces after formal production.
Recording and Prevention (Key Steps)
Fill out the Abnormal Condition Handling Record;Symptoms, causes, corrective actions, downtime;
Conduct a simple root cause analysis,Ask “Why?” repeatedly to identify underlying causes;Update the inspection checklist by adding newly discovered issues to the daily inspection form.
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